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Investigation of thermal effects on MEMS-based PLL and its compensation

Number of pages: 81 File Format: word File Code: 32184
Year: 2014 University Degree: Master's degree Category: Electronic Engineering
Tags/Keywords: MEMS - MEMS technology - Micro-electromechanical systems - PLL - the revealer - Thermal effects
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  • Summary of Investigation of thermal effects on MEMS-based PLL and its compensation

    Dissertation

    Presented to graduate education management as part of the educational activities required to obtain a master's degree

    in the field of mechatronics

    Abstract

    In this thesis, a phase lock loop based on micro systems It is designed electromechanically. The loop system has a feedback phase lock that compares the input phase with the output phase. This comparison is done by a phase detector. A phase detector is a circuit whose average output voltage is linearly proportional to the phase difference between two inputs. It is tried to keep the frequency difference between the input and output in a phase-locked loop constant, and for this reason, the effects of temperature change on this loop will be investigated and thermal compensation methods will be presented using neural network. As you can see, the temperature affects the loop and causes a change in the output frequency, and the goal is to keep the input and output frequencies constant in the loop. The goal is to minimize the frequency difference between input and output in a phase-locked loop.

    Introduction

    Micro-electromechanical systems [1] is one of the promising technologies of this century, which due to its many capabilities and advantages, can create a great transformation in industrial, commercial and consumer products. These systems are micro devices that can affect the macro environment. Research on the design, production and application of micro-electromechanical systems is currently being pursued seriously in the world and a huge investment is made in this field.

    In this section, at the beginning, while providing a general definition for a brief introduction to these systems, and then a brief history, and then the advantages, features, applications, manufacturing methods and materials used in MEMS and

    1-2 definition of MEMS

    MEMS technology or micro-electromechanical systems technology is the result of combining mechanical components, sensors, actuators and electronic components on a silicon layer with the help of micron chip manufacturing technology [1].

    Micromechanics

    Micro actuators

    Micro sensor

    Microelectromechanical system

    Microelectronics

     

    The dimensions of MEMS parts according to b) covers a wide range, from dimensions smaller than one micrometer that cannot be seen with the eye to dimensions of one millimeter, also types of these systems can be in a simple state, a tool without a moving part or in complex states, with multiple moving components that are controlled by electronic control systems.

    Micro electromechanical systems or MEMS is a term that first became common in the late 1980s in the United States to name this type of system, and these systems are also called MST in Europe and small machines[2] in Japan. they go, it is used; In other words, micro-electromechanical systems can be considered an attempt to exploit and expand the developed manufacturing techniques in the integrated circuits industry to add mechanical elements such as beams, gears, diaphragms and springs to electronic circuits and produce an integrated micro system for perception and control of the physical world [1]. The capabilities of micro-sensors and micro-stimulators and the expansion of the possible space of design and use.

    Microelectronics integrated circuits can be considered as the mastermind of a system, and MEMS provides this decision-making capability with eyes and arms..

    Microelectronic integrated circuits can be considered as the mastermind of a system, and MEMS increases this decision-making capability with eyes and arms to allow microsensors to collect changes around the system by receiving information from mechanical, thermal, biological, chemical, optical, or magnetic phenomena. After receiving information from sensors, electromechanical devices, with the help of their decision-making power, turn stimuli into responses such as moving, moving, adjusting, pumping, filtering, and so on.  They force and direct the environment towards the desired results.

    The real potential of micro-electromechanical systems appears when micro-sensors, micro-actuators and micro-structures are combined on a silicon board and connected to an electronic circuit. MEMS manufacturing techniques enable components and devices to be produced with greater efficiency and capability; At the same time, they have advantages such as reducing physical size, volume, weight and cost [1] Figure (1-3) shows an example of MEMS products in micro dimensions.

    Abstract:

    In this thesis a Phase-Locked Loop based on micro-electromechanical systems are designed. Micro-electro-mechanical systems are a feedback control system that compares the input phase with the output phase. This comparison is done by a phase detector. The phase detector is a circuit that its average output voltage is proportional linearly with the phase difference between the two inputs. We want the frequency difference between input and output in the fixed phase lock loops to be stable and so we check the effects of temperature changes on this loop and thermal compensation method using neural network offer. Because as you can see temperature can effect on the ring and cause a change in the frequency of the output, and our purpose is that a fixed input and output frequencies in the loop be achieved. Our purpose is to minimize the frequency difference between input and output in the phase locked loop.

  • Contents & References of Investigation of thermal effects on MEMS-based PLL and its compensation

    List:

    Chapter One: Microelectromechanical Systems

    1-1 Introduction. 2

    1-2 Definition of MEMS. 2

    1-3 history. 4

    1-4 miniaturization as the main feature of MEMS. 6

    1-5 reasons and advantages of miniaturization in MEMS technology. 7

    1-6 advantages of MEMS technology. 8

    1-7 MEMS applications. 9

    1-8 The need for development and progress in the field of MEMS. 12

    1-9 Design and manufacturing technology of microelectromechanical systems. 13

    1-9-1 Design. 13

    1-9-2 manufacturing technology. 14

    1-9-2-1 transferring the plan on the platform. 14

    1-9-2-2 exfoliation. 14

    1-9-2-3 layering. 15

    1-10 materials used in MEMS. 16

    1-10-1 silicon oxide SiO2 18

    1-10-2 silicon nitride Si3N4 18

    1-10-3 silicon carbide (SiC) 18

    1-11 reasons for using silicon crystal in MEMS. 19

    Chapter Two: Voltage Controlled Oscillators

    2-1 Introduction. 21

    2-2 voltage controlled oscillator (VCO) 21

    2-3 types of oscillator. 22

    2-4 LC-VCO. 24

    2-5 vertical oscillator. 25

    2-6 Q-VCO. 29

    2-7 Phase noise and time jitter. 30

    2-7-1 phase noise. 30

    2-7-2 time jitter. 31

    Chapter 3: phase lock loop

    3-1 Introduction. 34

    3-2 How PLL works. 34

    3-3 PLL components. 34

    3-4 phase detector. 35

    3-5 PLL block diagram. 35

    3-6 PLL relationships. 35

    3-7 PLL applications. 37

    3-8 MEMS-based PLL. 37

    3-9 quartz crystal. 37

    3-10 previous methods for thermal compensation. 40

    Chapter Four: Simulation and Analysis of Results

    4-1 Simulation. 51

    4-2 Coding with PSO. 52

    4-2-1 Coding with a neural network. 56

    3-4 Results. 61

    Chapter Five: Conclusion and Suggestions

    5-1 Conclusion. 65

    References. 67

     

     

    Source:

     

    S. P. Beeby, G. Ensel, and M. Kraft, 2004, “MEMS Mechanical Sensors”, Artech House.

    D. S. Eddy and D. R. Sparks, 1998, “Application of MEMS Technology in automotive sensors and actuators,” Proceedings of the IEEE, vol. 86, pp. 1747-1755.

    S. Kota and G. K. Ananthasuresh, S. B. Crary and K. D. Wise, "Design and Fabrication of Microelectromechanical Systems", Journal of Mechanical Design December 1994, vol. 116.

    Ali Hajmiri and Thomas H. Lee, "The Design of Low Noise Oscillators"., Kluwer Academic Publishers, NewYork, Boston., 2003.

    B. Z. Kaplen, "On the simplified implementation of quadrature oscillator models and the expected quality of their operation as VCO's," Proc. IEEE, vol. 68, pp. 745-746, 1980.

    G. A. Korn and T. M. Korn, Electronic Analog and Hybrid Computers New York: McGraw-Hill, 2nd ed. 1972, p. 252.

    R. Genin and J. Genin, "Nouveau modele d'oscillatoeur non Lineare donnant deux signales sinusoidaux en quadrature", C. R.Acad. Sci., series A, vol. 286, pp. 377-379, 1978.

    B. Adkins, "The General Theory of Electrical Machines". London: Chapman and Hall, 1959.

    M. K. Parasuram and B. Ramaswami, “A three phase sine wave reference generator for thyristorized motor controllers,” IEEE Trans. Ind. Electron. Contra. Instrument., vol. IEC-23, pp. 270-276, 1976.

    Wei Tingcun; Chen Yingmei; Hu Zhengfei. Analog CMOS IC Design, Tsinghua University Press, 2010 : 267-271

    Zhou, H. F.; Han, Y.; Dong, S. R.; Wang, C. H., “An Ultra-Low-Voltage High-Performance VCO in 0.13?m digital CMOS process,” Journal of Electromagnetic Waves and Applications, 2008, No. 17-18, vol. 22:2417-2426.

    H. J. McSkimin, "Measurement of elastic constant at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica," J. Appl. Phys., vol. 24, no. 8, pp. 988-997, Aug. 1953.

    Y.-H. Chuang, S.-H. Lee R.-H. Yen, S.-L. Jang, and M.-H. Juang, “A low-voltage quadrature CMOS VCO based on voltage-voltage feedback topology,” IEEE Microw.,16, no. 12, pp. 696-698. December 2006.

    L. Lin and P. R. Gray, “A 1.4 GHz differential low-noise CMOS frequency synthesizer using a wideband PLL architecture,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2000, pp. 204-205, 458

    M. Gradner, “Phase-lock Techniques. New York: Wiley”, in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2000, pp. 204-205, 45817.

    H. J. McSkimin, "Measurement of elastic constant at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica," J. Appl. Phys., vol. 24, no. 8, pp. 988-997, Aug. 1953.

     

    J. Wang, J. E. Butler, T. Feygelson, and C. T. C. Nguyen, “1.5 GHz Nanocrystalline diamond micromechanical resonator with material mismatched insulating support,” in Proc. IEEE MEMS 2004, Jan. 2004, pp.641-644.

    K. Ho. Gavin, K. Sundaresan, S. Pourkamali, and F. Ayazi, "Micromechanical IBARs: Tunable High-Q Resonators for Temperature-Compensated Reference Oscillators", Georgia Institute of Technology, Atlanta, IEEE., January 31, 2010., JOURNAL OF MICRO ELECTROMECHANICAL SYSTEMS, VOL. 19, NO. 3, JUNE 2010.

    R. Tabrizian, G. Casinovi and F. Ayazi, "Temperature-Stable High-QAIN-on-Silicon resonators with Embedded Array of Oxide Pillars," Solid-State Sensors, Actuators, and Microsystems workshop (Hilton Head 2010), June 2010, pp. 100-101.

    R. Tabrizian, M. Pardo and F. Ayazi, “A 27 MHZ TEMPERATURE COMPENSATED MEMS OSCILLATOR WITH SUB-PPM INSTABILITY”, Georgia Institute of Technology, Atlanta, Georgia, USA, IEEE, 978-1-4673-0325-5, 2012.

    K. Ho. Gavin, K. Sundaresan, S. Pourkamali, and F. Ayazi “Electronically Temperature Compensated Silicon Bulk Acoustic Resonator Reference Oscillators”, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, and is now with GE Global Research, Niskayuna, NY 12309 USA, IEEE. 2007., IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 42, NO. 6, JUNE 2007.

    J. C. Salvia, R. Melamud, S. A. Chandorkar, S. F. Lord, and T.W. Kenny., "Real-Time Temperature Compensation of MEMS Oscillators Using an Integrated Micro-Oven and a Phase-Locked Loop".

Investigation of thermal effects on MEMS-based PLL and its compensation
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