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Investigation of thermal effects on MEMS-based PLL and its compensation

Number of pages: 81 File Format: word File Code: 32170
Year: 2014 University Degree: Master's degree Category: Electronic Engineering
Tags/Keywords: Electronic circuits - Electronic control - MEMS - Micro electromechanical systems - Sensor - Silicone tools - Thermal effects
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  • Summary of Investigation of thermal effects on MEMS-based PLL and its compensation

    Presented to graduate education management as part of the educational activities required to obtain a master's degree

    The dimensions of MEMS components according to Figure (1-2) include a wide range, from dimensions smaller than one micrometer that cannot be seen with the eye to dimensions of one millimeter, also a variety of these systems can be in a simple state, a tool without a moving part, or in complex states, it has multiple moving components that are controlled by electronic control systems.

    (Images are available in the main file)

    Micro Electromechanical Systems or MEMS is a term that first became common in the late 1980s in the United States to name this type of system, and these systems are also called MST in Europe and micromachines[1] in Japan. is used; In other words, micro-electromechanical systems can be considered as an attempt to exploit and expand the developed manufacturing techniques in the integrated circuits industry to add mechanical elements such as beams, gears, diaphragms and springs to electronic circuits and produce an integrated micro system for perception and control of the physical world [1]. Stimulators and expansion gives the possible space of design and use. Microelectronic integrated circuits can be considered as the mastermind of a system, and MEMS increases this decision-making capability with eyes and arms to allow microsensors to collect changes around the system by receiving information from mechanical, thermal, biological, chemical, optical, or magnetic phenomena. After receiving information from sensors, electromechanical devices, with the help of their decision-making power, turn stimuli into responses such as moving, moving, adjusting, pumping, filtering, and so on.  They force and direct the environment towards the desired results.

    The real potential of micro-electromechanical systems appears when micro-sensors, micro-actuators and micro-structures are combined on a silicon board and connected to an electronic circuit. MEMS manufacturing techniques enable components and devices to be produced with greater efficiency and capability; At the same time, they have advantages such as reducing physical size, volume, weight, and cost [1] Figure (1-3) shows an example of MEMS products in micro dimensions. In this speech, he presented ideas and perspectives on work design, engineering knowledge and applications of very small systems and machines. In 1983, he gave another speech on this issue and interesting predictions, most of which have been realized so far and some others are the subject of research.

    In 1982, Kurt Petersen [2] from IBM Company, after several years of research and testing, published an article in which, by stating the results of his research, he showed that silicon has very good properties and capabilities, including strength for making very small mechanical parts. Silicon was used in abundance and there were necessary processes for making silicon devices (such as lithography, exfoliation, etc.), this article made the manufacture of silicon mechanical parts popular and advanced. Petersen's 1982 article is considered by many people as the official starting point of MEMS technology [2].

    Although scattered works on the construction of very small systems were done and published before that, some of the most important events that led to the development of this technology are listed below:

    1948: Invention of Germanium transistor in Bell Lab by William Shockley[3]

    1954: Identification of piezoresistive effect in silicon and germanium by Mr.

    Although before that, scattered works on the construction of very small systems have been done and published, and below, some of the most important events that have led to the development of this technology are listed:

    1948: The invention of the Germanium transistor in the Bell Laboratory by William Shockley [3]

    1954: The identification of the piezoresistive effect in silicon and germanium by Mr. Smith[4]

    1958: The construction of the first integrated circuit by Jack Kilby [5]

    1959: The unveiling of the first silicon pressure sensor

    1967: The presentation of the first silicon deep anisotropic etching method

    1968: The invention of the resonant gate transistor using the surface micromachining method

    1970: The construction of sensors Pressure by volumetric micromachining process

    1971: invention of microprocessor

    1979: production of inkjet nozzle by HPilby company

    Abstract:

    In this thesis a Phase-Locked Loop based on micro-electromechanical systems are designed. Micro-electro-mechanical systems are a feedback control system that compares the input phase with the output phase. This comparison is done by a phase detector. The phase detector is a circuit that its average output voltage is proportional linearly with the phase difference between the two inputs. We want the frequency difference between input and output in the fixed phase lock loops to be stable and so we check the effects of temperature changes on this loop and thermal compensation method using neural network offer. Because as you can see temperature can effect on the ring and cause a change in the frequency of the output, and our purpose is that a fixed input and output frequencies in the loop be achieved. Our purpose is to minimize the frequency difference between input and output in the phase locked loop.

  • Contents & References of Investigation of thermal effects on MEMS-based PLL and its compensation

    List:

    Chapter One: Microelectromechanical Systems

    1-1 Introduction. 2

    1-2 Definition of MEMS. 2

    1-3 history. 4

    1-4 miniaturization as the main feature of MEMS. 6

    1-5 reasons and advantages of miniaturization in MEMS technology. 7

    1-6 advantages of MEMS technology. 8

    1-7 MEMS applications. 9

    1-8 The need for development and progress in the field of MEMS. 12

    1-9 Design and manufacturing technology of microelectromechanical systems. 13

    1-9-1 Design. 13

    1-9-2 manufacturing technology. 14

    1-9-2-1 transferring the plan on the platform. 14

    1-9-2-2 exfoliation. 14

    1-9-2-3 layering. 15

    1-10 materials used in MEMS. 16

    1-10-1 silicon oxide SiO2 18

    1-10-2 silicon nitride Si3N4 18

    1-10-3 silicon carbide (SiC) 18

    1-11 reasons for using silicon crystal in MEMS. 19

    Chapter Two: Voltage Controlled Oscillators

    2-1 Introduction. 21

    2-2 voltage controlled oscillator (VCO) 21

    2-3 types of oscillator. 22

    2-4 LC-VCO. 24

    2-5 vertical oscillator. 25

    2-6 Q-VCO. 29

    2-7 Phase noise and time jitter. 30

    2-7-1 phase noise. 30

    2-7-2 time jitter. 31

    Chapter 3: phase lock loop

    3-1 Introduction. 34

    3-2 How PLL works. 34

    3-3 PLL components. 34

    3-4 phase detector. 35

    3-5 PLL block diagram. 35

    3-6 PLL relationships. 35

    3-7 PLL applications. 37

    3-8 MEMS-based PLL. 37

    3-9 quartz crystal. 37

    3-10 previous methods for thermal compensation. 40

    Chapter Four: Simulation and Analysis of Results

    4-1 Simulation. 51

    4-2 Coding with PSO. 52

    4-2-1 Coding with a neural network. 56

    3-4 Results. 61

    Chapter Five: Conclusion and Suggestions

    5-1 Conclusion. 65

    References. 67

     

     

    Source:

     

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    S. Kota and G. K. Ananthasuresh, S. B. Crary and K. D. Wise, "Design and Fabrication of Microelectromechanical Systems", Journal of Mechanical Design December 1994, vol. 116.

    Ali Hajmiri and Thomas H. Lee, "The Design of Low Noise Oscillators"., Kluwer Academic Publishers, NewYork, Boston., 2003.

    B. Z. Kaplen, "On the simplified implementation of quadrature oscillator models and the expected quality of their operation as VCO's," Proc. IEEE, vol. 68, pp. 745-746, 1980.

    G. A. Korn and T. M. Korn, Electronic Analog and Hybrid Computers New York: McGraw-Hill, 2nd ed. 1972, p. 252.

    R. Genin and J. Genin, "Nouveau modele d'oscillatoeur non Lineare donnant deux signales sinusoidaux en quadrature", C. R.Acad. Sci., series A, vol. 286, pp. 377-379, 1978.

    B. Adkins, "The General Theory of Electrical Machines". London: Chapman and Hall, 1959.

    M. K. Parasuram and B. Ramaswami, “A three phase sine wave reference generator for thyristorized motor controllers,” IEEE Trans. Ind. Electron. Contra. Instrument., vol. IEC-23, pp. 270-276, 1976.

    Wei Tingcun; Chen Yingmei; Hu Zhengfei. Analog CMOS IC Design, Tsinghua University Press, 2010 : 267-271

    Zhou, H. F.; Han, Y.; Dong, S. R.; Wang, C. H., “An Ultra-Low-Voltage High-Performance VCO in 0.13?m digital CMOS process,” Journal of Electromagnetic Waves and Applications, 2008, No. 17-18, vol. 22:2417-2426.

    H. J. McSkimin, "Measurement of elastic constant at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica," J. Appl. Phys., vol. 24, no. 8, pp. 988-997, Aug. 1953.

    Y.-H. Chuang, S.-H. Lee R.-H. Yen, S.-L. Jang, and M.-H. Juang, “A low-voltage quadrature CMOS VCO based on voltage-voltage feedback topology,” IEEE Microw.,16, no. 12, pp. 696-698. December 2006.

    L. Lin and P. R. Gray, “A 1.4 GHz differential low-noise CMOS frequency synthesizer using a wideband PLL architecture,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2000, pp. 204-205, 458

    M. Gradner, “Phase-lock Techniques. New York: Wiley”, in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2000, pp. 204-205, 45817.

    H. J. McSkimin, "Measurement of elastic constant at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica," J. Appl. Phys., vol. 24, no. 8, pp. 988-997, Aug. 1953.

     

    J. Wang, J. E. Butler, T. Feygelson, and C. T. C. Nguyen, “1.5 GHz Nanocrystalline diamond micromechanical resonator with material mismatched insulating support,” in Proc. IEEE MEMS 2004, Jan. 2004, pp.641-644.

    K. Ho. Gavin, K. Sundaresan, S. Pourkamali, and F. Ayazi, "Micromechanical IBARs: Tunable High-Q Resonators for Temperature-Compensated Reference Oscillators", Georgia Institute of Technology, Atlanta, IEEE., January 31, 2010., JOURNAL OF MICRO ELECTROMECHANICAL SYSTEMS, VOL. 19, NO. 3, JUNE 2010.

    R. Tabrizian, G. Casinovi and F. Ayazi, "Temperature-Stable High-QAIN-on-Silicon resonators with Embedded Array of Oxide Pillars," Solid-State Sensors, Actuators, and Microsystems workshop (Hilton Head 2010), June 2010, pp. 100-101.

    R. Tabrizian, M. Pardo and F. Ayazi, “A 27 MHZ TEMPERATURE COMPENSATED MEMS OSCILLATOR WITH SUB-PPM INSTABILITY”, Georgia Institute of Technology, Atlanta, Georgia, USA, IEEE, 978-1-4673-0325-5, 2012.

    K. Ho. Gavin, K. Sundaresan, S. Pourkamali, and F. Ayazi “Electronically Temperature Compensated Silicon Bulk Acoustic Resonator Reference Oscillators”, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, and is now with GE Global Research, Niskayuna, NY 12309 USA, IEEE. 2007., IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 42, NO. 6, JUNE 2007.

    J. C. Salvia, R. Melamud, S. A. Chandorkar, S. F. Lord, and T.W. Kenny., "Real-Time Temperature Compensation of MEMS Oscillators Using an Integrated Micro-Oven and a Phase-Locked Loop"., JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 19, NO. 1, FEBRUARY 2010.

Investigation of thermal effects on MEMS-based PLL and its compensation
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