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Investigation of thermal effects on MEMS-based PLL and its compensation

Number of pages: 80 File Format: word File Code: 31341
Year: 2014 University Degree: Master's degree Category: Electrical Engineering
Tags/Keywords: Investigation of thermal effects on PLL - MEMS - PLL - Thermal effects - Thermal effects on MEMS-based PLL
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  • Summary of Investigation of thermal effects on MEMS-based PLL and its compensation

    Dissertation

    Mass degree

    in the field of mechatronics

    Abstract

    In this thesis, a phase-locked loop based on micro-electromechanical systems is designed. The loop system has a feedback phase lock that compares the input phase with the output phase. This comparison is done by a phase detector. Phase detector is a circuit whose average output voltage is linearly proportional to the phase difference between two inputs. It is tried to keep the frequency difference between the input and output in a phase-locked loop constant, and for this reason, the effects of temperature change on this loop will be investigated and thermal compensation methods will be presented using neural network. As you can see, the temperature affects the loop and causes a change in the output frequency, and the goal is to keep the input and output frequencies constant in the loop. The goal is to minimize the frequency difference between input and output in a phase-locked loop.

    Introduction

    Micro-electromechanical systems [1] are one of the promising technologies of the current century, which, due to its many capabilities and advantages, can create a great transformation in industrial, commercial and consumer products. These systems are micro devices that can affect the macro environment. Research on the design, production and application of micro-electromechanical systems is currently being pursued seriously in the world and a huge investment is made in this field. In this section, at the beginning, while providing a general definition for a brief introduction to these systems, and then a brief history, and then the advantages, features, applications, manufacturing methods and materials used in MEMS and

    1-2 Definition of MEMS

    MEMS technology or microelectromechanical systems technology is the result of combining mechanical components, sensors, actuators and electronic parts (Figure (1-1)) on a silicon layer with the help of micron chip manufacturing technology [1].

    Micromechanics

     

    Micro actuators

    Micro sensor

    Microelectromechanical system

     

    Microelectronics

     

     

    Figure 1-1: MEMS components [1]

    The dimensions of MEMS components according to Figure (1-2) include a wide range, from dimensions smaller than one micrometer that cannot be seen with the eye to dimensions of one millimeter, also types of these systems can be in a simple state, a tool without a moving part, or in complex states, it has multiple moving components with Electronic control systems are guided.

    The name is MST and in Japan it is also called micro machines[2].

    To make MEMS devices, techniques and materials used in making integrated circuits [3] are used; In other words, micro-electromechanical systems can be considered as an attempt to exploit and expand the developed manufacturing techniques in the integrated circuits industry to add mechanical elements such as beams, gears, diaphragms and springs to electronic circuits and produce integrated micro systems for perception and control of the physical world [1]. Sensors and micro-actuators and expansion gives the possible space of design and use.

    Microelectronic integrated circuits can be considered as the mastermind of a system, and MEMS augments this decision-making capability with eyes and arms to allow microsensors to collect changes around the system by receiving information from mechanical, thermal, biological, chemical, optical, or magnetic phenomena. After receiving information from sensors, electromechanical devices, with the help of their decision-making power, turn stimuli into responses such as moving, moving, adjusting, pumping, filtering, and so on.  The real potential of micro-electromechanical systems appears when micro-sensors, micro-actuators and micro-structures are combined on a silicon board and connected to an electronic circuit. MEMS manufacturing techniques enable components and devices to be produced with greater efficiency and capability; At the same time, they have advantages such as reducing physical size, volume, weight, and cost [1] Figure (1-3) shows an example of MEMS products in micro dimensions.

    The idea of ??making very small systems was proposed in 1959 by the famous physicist Richard Feitman in a lecture [4]. In this speech, he presented ideas and perspectives on work design, engineering knowledge and applications of very small systems and machines. In 1983, he gave another speech on this problem and interesting predictions, most of which have been realized so far and some others are also the subject of research. In 1982, Kurt Petersen[5] from IBM published an article after several years of research and testing, in which he stated the results of his research and showed that silicon has very good properties and capabilities, including strength, for making very small mechanical parts.

    Since that silicon was used abundantly in the manufacture of integrated circuits and there were necessary processes for the manufacture of silicon devices (such as lithography, layering, etc.), this article caused the manufacture of silicon mechanical parts to spread and progress rapidly. Petersen's 1982 paper is considered by many to be the official starting point of MEMS technology [2].

  • Contents & References of Investigation of thermal effects on MEMS-based PLL and its compensation

    List:

    Chapter One: Microelectromechanical Systems

    1-1 Introduction. 2

    1-2 Definition of MEMS. 2

    1-3 history. 4

    1-4 miniaturization as the main feature of MEMS. 6

    1-5 reasons and advantages of miniaturization in MEMS technology. 7

    1-6 advantages of MEMS technology. 8

    1-7 MEMS applications. 9

    1-8 The need for development and progress in the field of MEMS. 12

    1-9 Design and manufacturing technology of microelectromechanical systems. 13

    1-9-1 Design. 13

    1-9-2 manufacturing technology. 14

    1-9-2-1 transferring the plan on the platform. 14

    1-9-2-2 exfoliation. 14

    1-9-2-3 layering. 15

    1-10 materials used in MEMS. 16

    1-10-1 silicon oxide SiO2 18

    1-10-2 silicon nitride Si3N4 18

    1-10-3 silicon carbide (SiC) 18

    1-11 reasons for using silicon crystal in MEMS. 19

    Chapter Two: Voltage Controlled Oscillators

    2-1 Introduction. 21

    2-2 voltage controlled oscillator (VCO) 21

    2-3 types of oscillator. 22

    2-4 LC-VCO. 24

    2-5 vertical oscillator. 25

    2-6 Q-VCO. 29

    2-7 Phase noise and time jitter. 30

    2-7-1 phase noise. 30

    2-7-2 time jitter. 31

    Chapter 3: phase lock loop

    3-1 Introduction. 34

    3-2 How PLL works. 34

    3-3 PLL components. 34

    3-4 phase detector. 35

    3-5 PLL block diagram. 35

    3-6 PLL relationships. 35

    3-7 PLL applications. 37

    3-8 MEMS-based PLL. 37

    3-9 quartz crystal. 37

    3-10 previous methods for thermal compensation. 40

    Chapter Four: Simulation and Analysis of Results

    4-1 Simulation. 51

    4-2 Coding with PSO. 52

    4-2-1 Coding with a neural network. 56

    3-4 Results. 61

    Chapter Five: Conclusion and Suggestions

    5-1 Conclusion. 65

    References. 67

    Source:

    References

    S. P. Beeby, G. Ensel, and M. Kraft, 2004, “MEMS Mechanical Sensors”, Artech House.

    D. S. Eddy and D. R. Sparks, 1998, “Application of MEMS Technology in automotive sensors and actuators,” Proceedings of the IEEE, vol. 86, pp. 1747-1755.

    S. Kota and G. K. Ananthasuresh, S. B. Crary and K. D. Wise, "Design and Fabrication of Microelectromechanical Systems", Journal of Mechanical Design December 1994, vol. 116.

    Ali Hajmiri and Thomas H. Lee, "The Design of Low Noise Oscillators"., Kluwer Academic Publishers, NewYork, Boston., 2003.

    B. Z. Kaplen, "On the simplified implementation of quadrature oscillator models and the expected quality of their operation as VCO's," Proc. IEEE, vol. 68, pp. 745-746, 1980.

    G. A. Korn and T. M. Korn, Electronic Analog and Hybrid Computers New York: McGraw-Hill, 2nd ed. 1972, p. 252.

    R. Genin and J. Genin, "Nouveau modele d'oscillatoeur non Lineare donnant deux signales sinusoidaux en quadrature", C. R.Acad. Sci., series A, vol. 286, pp. 377-379, 1978.

    B. Adkins, "The General Theory of Electrical Machines". London: Chapman and Hall, 1959.

    M. K. Parasuram and B. Ramaswami, “A three phase sine wave reference generator for thyristorized motor controllers,” IEEE Trans. Ind. Electron. Contra. Instrument., vol. IEC-23, pp. 270-276, 1976.

    Wei Tingcun; Chen Yingmei; Hu Zhengfei. Analog CMOS IC Design, Tsinghua University Press, 2010 : 267-271

    Zhou, H. F.; Han, Y.; Dong, S. R.; Wang, C. H., “An Ultra-Low-Voltage High-Performance VCO in 0.13?m digital CMOS process,” Journal of Electromagnetic Waves and Applications, 2008, No. 17-18, vol. 22:2417-2426.

    H. J. McSkimin, "Measurement of elastic constant at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica," J. Appl. Phys., vol. 24, no. 8, pp. 988-997, Aug. 1953.

    Y.-H. Chuang, S.-H. Lee R.-H. Yen, S.-L. Jang, and M.-H. Juang, “A low-voltage quadrature CMOS VCO based on voltage-voltage feedback topology,” IEEE Microw., vol.16, no. 12, pp.696-698. December 2006.

    L. Lin and P. R. Gray, “A 1.4 GHz differential low-noise CMOS frequency synthesizer using a wideband PLL architecture,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2000, pp. 204-205, 458

    M. Gradner, “Phase-lock Techniques. New York: Wiley”, in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2000, pp. 204-205, 45817.

    H. J. McSkimin, "Measurement of elastic constant at low temperature by means of ultrasonic waves data for silicon and germanium single crystals and for fused silica," J. Appl. Phys., vol. 24, no. 8, pp. 988-997, Aug. 1953.

     

    J. Wang, J. E. Butler, T. Feygelson, and C. T. C. Nguyen, “1.5 GHz Nanocrystalline diamond micromechanical resonator with material mismatched insulating support,” in Proc. IEEE MEMS 2004, Jan. 2004, pp.641-644.

    K. Ho. Gavin, K. Sundaresan, S. Pourkamali, and F. Ayazi, "Micromechanical IBARs: Tunable High-Q Resonators for Temperature-Compensated Reference Oscillators", Georgia Institute of Technology, Atlanta, IEEE., January 31, 2010., JOURNAL OF MICRO ELECTROMECHANICAL SYSTEMS, VOL. 19, NO. 3, JUNE 2010.

    R. Tabrizian, G. Casinovi and F. Ayazi, "Temperature-Stable High-QAIN-on-Silicon resonators with Embedded Array of Oxide Pillars," Solid-State Sensors, Actuators, and Microsystems workshop (Hilton Head 2010), June 2010, pp. 100-101.

    R. Tabrizian, M. Pardo and F. Ayazi, “A 27 MHZ TEMPERATURE COMPENSATED MEMS OSCILLATOR WITH SUB-PPM INSTABILITY”, Georgia Institute of Technology, Atlanta, Georgia, USA, IEEE, 978-1-4673-0325-5, 2012.

    K. Ho. Gavin, K. Sundaresan, S. Pourkamali, and F. Ayazi “Electronically Temperature Compensated Silicon Bulk Acoustic Resonator Reference Oscillators”, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA, and is now with GE Global Research, Niskayuna, NY 12309 USA, IEEE. 2007., IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 42, NO. 6, JUNE 2007.

    J. C. Salvia, R. Melamud, S. A. Chandorkar, S. F. Lord, and T.W. Kenny., "Real-Time Temperature Compensation of MEMS Oscillators Using an Integrated Micro-Oven and a Phase-Locked Loop"., JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 19, NO. 1, FEBRUARY 2010.

Investigation of thermal effects on MEMS-based PLL and its compensation
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